Printed Circuit Boards

Printed Circuit Board Fabrication

Quickturn Delivery

  • Rigid PCB, Flex Circuits, Rigid Flex
  • Fast Delivery of Complex Multilayer and HDI
  • Prototype and NPI
  • Seamless Migration to Asia for Production Volume

Production Volume

  • Rigid, Flex, Rigid Flex
  • High Reliability Complex Multilayer and HDI
  • Global Facilities - North America and Asia

PCB Fabrication Capabilities – Rigid PCB

Conventional PCBs

Conventional PCBs can be any layer count, but rely on conventional drilling and plating technology.

  • Multilayer up to 60+ layers
  • Wide range of laminate options including high temperature, low loss and lead-free laminates
  • Mixed dielectric (hybrid) constructions
  • Panel size up to 30"x 55"
  • Embedded coin, or metal core and metal backed MLB
  • Panel thickness up to .450"
  • RF and microwave circuits
  • Heavy copper (10 oz. outer layer / 5 oz.  inner layer)
  • Embedded, distributed and discrete passive components

High Density Interconnect PCBs

Microvias can be via-in-pad, offset, staggered or stacked, non-conductive filled and copper plated over the top or solid copper filled or plated.

  • Microvias
  • Stacked Microvias
  • Deep Microvia
  • Deep Stacked Microvia
  • Any Layer HDI

Multilayer copper filled stacked micro via structure 1.2/1.2 mil line/space 4/8 mil laser via capture pad size Material options:

  • High temperature FR4
  • Halogen - Free
  • High Speed (low loss)

Flex and Rigid Flex - PCB Site Certifications

  • Type 1: Single sided flexible material with or without shield(s) or stiffener (one conductive layer).
  • Type 2: Double sided flexible material with or without shield(s) or stiffener (two conductor layers) with plated through holes.
  • Type 3: Multilayer flexible material with or without shield(s) or stiffener (more than two conductor layers) with plated through holes and HDI.
  • Type 4: Multilayer rigid and flexible material combinations (more than two conductor layers) with plated through holes and HDI.

ISO 9001, ISO13485, ISO14001, AS9100C, TS16949, MIL-PRF-31032, MIL-PRF-55110(G), ITAR, NADCAP, UL796,Bellcore Compliant, TL9000